[ecoop-info] IEEE PerCom 2010 cfp - Submission Deadline: Sept. 28, 2009

Paolo Bellavista paolo.bellavista at unibo.it
Thu Sep 10 18:26:49 CEST 2009

Our sincere apologies if you receive multiple copies of this announcement.

                              CALL FOR PAPERS

Eighth IEEE International Conference on Pervasive Computing and Communications
                    PerCom 2010 (http//www.percom.org/)

                Mannheim, Germany, March 29 - April 2, 2010

            **** Paper Submission Deadline --- September 28, 2009 ****

                                Sponsored by

                           IEEE, IEEE Computer Society
                      The University of Texas at Arlington
                             IEEE TCPP,  IEEE TCCC


IEEE PerCom, now at its eighth edition, is the 
premier scholarly venue in the areas of pervasive 
computing and communications, which aim at 
providing a ubiquitous platform for supporting 
exciting anytime and anyplace services paradigms. 
Pervasive computing and communications is a 
natural outcome of the tremendous advances of a 
broad spectrum of technologies including wireless 
networking, sensor networks, mobile and 
distributed computing, and agent technologies. 
PerCom 2010 will provide a high profile, leading 
edge forum for researchers and engineers alike to 
present state-of-the-art research in the 
respective fields of pervasive computing and 
communications. The conference will feature a 
diverse mixture of presentation forums including 
core technical sessions, several targeted 
workshops, demonstrations, keynote speeches and 
panel discussions from domain experts.


Research contributions are solicited in all areas 
pertinent to pervasive computing and communications, including:

- Innovative pervasive computing applications
- Programming paradigms for pervasive systems
- Software evolution and maintenance in pervasive systems
- Middleware services and agent technologies
- Adaptive, autonomic and context-aware computing
- Mobile/Wireless computing systems and services in pervasive computing
- Energy-efficient and green pervasive computing
- Communication architectures for pervasive computing
- Ad hoc networks for pervasive communications
- Pervasive opportunistic communications and applications
- Enabling technologies for pervasive systems (e.g., wireless BAN, PAN)
- Positioning and tracking technologies
- Sensors and RFID in pervasive systems
- Multimodal sensing and context for pervasive applications
- Pervasive sensing, perception and semantic interpretation
- Smart devices and intelligent environments
- Trust, security and privacy issues in pervasive systems
- User interfaces and interaction models
- Virtual immersive communications
- Wearable computers
- Standards and interfaces for pervasive computing environments
- Social and economic models for pervasive systems


Many workshops will be held in conjunction with 
the main conference. Workshop papers will be 
included and indexed in the IEEE digital 
libraries (Xplore), showing their affiliation 
with IEEE PerCom. As in the past, PerCom 2010 
will also feature a PhD Forum, Demonstrations and 
a Work-in-Progress Session.  Please visit the conference website for details.


Submitted papers must be unpublished and not 
considered elsewhere for publication. Also, they 
must show a significant relevance to pervasive 
computing and networking. Guidelines for 
preparing and submitting the manuscript are 
available on the conference website 
(http//www.percom.org/). All papers will be 
managed electronically through EDAS. Submitted 
papers will undergo a rigorous review process 
handled by the Technical Program Committee.


The best paper will receive the prestigious Mark 
Weiser Best Paper Award. Papers of particular 
merit will be considered for a special issue of 
the Elsevier journal of Pervasive and Mobile Computing (PMC).


   Paper Registration:  Sept. 25, 2009
   Paper Submission:    Sept. 28, 2009
   Author notification: Dec.  21, 2009
   Camera-ready due:    Jan.  29, 2010

For further Information, please contact Giuseppe 
Anastasi at <giuseppe.anastasi at iet.unipi.it>  or 
visit the conference website (http://www.percom.org)


General Co-chairs:
   Christian Becker, University of Mannheim, Germany
   Marco Conti, National Research Council, Italy

Program Chair:
   Giuseppe Anastasi, University of Pisa, Italy

Program Vice Chairs:
   Yonghe Liu, University of Texas at Arlington, USA
   Daniela Nicklas, University of Oldenburg, Germany
   Steve Ward, MIT, USA

Steering Committee Chair:
   Mohan Kumar, University of Texas at Arlington, USA

Workshops Co-chairs:
   Jalal Al Muhtadi, King Saud University, Saudi Arabia
   Andrea Passarella, National Research Council, Italy

Keynotes Chair:
   Vinny Cahill, Trinity College Dublin, Ireland

Panels Chair:
   Djamshid Tavangarian, University of Rostock, Germany

Work in Progress Chair:
   Achilles Kameas, University of Patras, Greece
   Joerg Ott, Helsinky University of Technology, Finland

Demo Co-chairs:
   Qi Han, Colorado School of Mines, USA
   Pedro Jose Marron, University of Bonn, Germany

Ph.D. Forum Chair:
   Claudio Bettini, University of Milan, Italy

Industrial Relations Co-chairs:
   Paul Castro, IBM, USA
   Igor Curcio, Nokia, Finland
   York Sure, SAP AG, Germany

Finance and Registration Chair:
   Gergely Záruba, University of Texas at Arlington, USA

Publication Chair:
   Emilio Ancillotti, National Research Council, Italy
   Alessio Vecchio, University of Pisa, Italy

Publicity Co-chairs:
   Franca Delmastro, National Research Council, Italy
   Dinh Q. Phung, Curtin University of Technology, Australia
   Damla Turgut, University of Central Florida, USA
   Zhiwen Yu, Northwestern Polytechnical University, China

Local Arrangements Chair:
   Gregor Schiele, University of Mannheim, Germany

Submission Chair:
   Antonio Pinizzotto, National Research Council, Italy

Website Liaison:
   Nayantara (Tara) Mallesh, University of Texas at Arlington, USA

   Jalal Al Muhtadi, King Saud University, Saudi Arabia
   Habib Ammari, Hofstra University, USA
   Francisco Ballestreros, Rey Juan Carlos University, Spain
   Stefano Basagni, Northeastern University, USA
   Martin Bauer, NEC Europe, Germany
   Paolo Bellavista, University of Bologna, Italy
   Claudio Bettini, University of Milan, Italy
   Chatschik Bisdikian, IBM TJ Watson Research, USA
   Susanne Boll, University of Oldenburg, Germany
   Luciano Bononi, University of Bologna, Italy
   Roy Campbell, University of Illinois at Urbana-Champaign, USA
   Jiannong Cao, Hong Kong Polytechnic University, HK
   Guohong Cao, Pennsylvania State University, USA
   Surendar Chandra, University of Notre Dame, USA
   Yingying Chen, Stevens Institute of Technology, USA
   Diane J. Cook, Washington State University, USA
   Paolo Costa, Microsoft Research, UK
   Franca Delmastro, National Research Council, Italy
   Karoly Farkas University of West Hungary, Hungary
   Christian Floerkemeier, MIT, USA
   Silvia Giordano, SUSPI, Switzerland
   Tao Gu, University of Southern Denmark, Denmark
   Isabelle Guérin Lassous, Université Lyon I/LIP, France
   Qi Han, Colorado School of Mines, USA
   Robert Harle, University of Cambridge, UK
   Wenbo He, University of New Mexico, USA
   Urs Hengartner, University of Waterloo, Canada
   Manfred Huber, University of Texas at Arlington, USA
   Jadwiga Indulska, University of Queensland Brisbane, Australia
   Vana Kalogeraki, University of California, Riverside, USA
   Achilles Kameas, University of Patras, Greece
   Birgitta König-Ries, Universität Jena, Germany
   Polychronis Koutsakis, Technical University of Crete, Greece
   Mohan Kumar, University of Texas at Arlington, USA
   Bob Kummerfeld, University of Sydney, Australia
   Brent Lagesse, University of Texas at Arlington, USA,
   Seng W. Loke, La Trobe University, Australia
   Ulrike Lucke University of Rostock, Germany
   Paul Lukowicz, University of Passau, Germany
   Xun Luo, Qualcomm Inc., USA
   Marco Mamei, Università di Modena e Reggio Emilia, Italy
   Cecilia Mascolo, University of Cambridge, UK
   Martin Mauve, Heinrich Heine University Düsseldorf, Germany
   Scott Midkiff, Virginia Tech, USA
   Bernhard Mitschang, University of Stuttgart, Germany
   Refik Molva, Eurecom, France
   Paul Muller, University of Kaiserslautern, Germany
   Matt Mutka, Michigan State University, USA
   Klara Nahrstedt, University of Illinois Urbana-Champaign, USA
   Lionel M. Ni, Hong Kong University of Science & Technology, HK
   Joerg Ott, Helsinki University of Technology, Finland
   Justin Mazzola Paluska, MIT, USA,
   Symeon Papavassiliou, National Technical University of Athens, Greece
   Andrea Passarella, National Research Council, Italy
   Tom Pfeifer, Waterford Institute of Technology, Ireland
   Gian Pietro Picco, University of Trento, Italy
   Claudio Pinhanez, IBM T.J. Watson Research Center, USA
   Dinh Phung, Curtin University of Technology, Australia
   Mandayam Raghunath, Google, India
   Tirumale Ramesh, Boeing, USA
   Anand Ranganathan, IBM T.J. Watson Research Center, USA
   Nishkam Ravi, Intel, Santa Clara, USA
   Daniele Riboni, University of Milan, Italy
   Kay Roemer, ETH Zurich, Switzerland
   Alex Rogers, Southampton University, UK
   George Roussos, Birkbeck College, University of London, UK
   Nirmalya Roy, University of Texas at Austin, USA
   Enrico Rukzio, Lancaster University, UK
   Ichiro Satoh, National Institute of Informatics, Japan
   Gregor Schiele, University of Mannheim, Germany
   Albrecht Schmidt, University of Duisburg-Essen, Germany
   Fabio A. Schreiber, Polytechnic of Milan, Italy
   Behrooz Shirazi, Washington State University, USA
   Morris Sloman, Imperial College London, UK,
   Ioannis Stavrakakis, National and Kapodistrian Univ. of Athens, Greece
   Thomas Strang, German Aerospace Center, Germany
   Gerhard Tröster, ETH Zürich, Switzerland
   Gene Tsudik, University of California at Irvine, USA
   Alessio Vecchio, University of Pisa, Italy
   Nalini Venkatasubramamian, University of California at Irvine, USA
   Matthew Wright, University of Texas at Arlington, USA
   Li Xiao, Michigan State University, USA
   David Yates, Bentley University, USA
   Franco Zambonelli, University of Modena and Reggio, Italy
   Gergely Zaruba, University of Texas at Arlington, USA
   Daqing Zhang, GET/INT-National Institute of Telecommunications, France
   Yanchao Zhang, New Jersey Institute of Technology, USA

Paolo Bellavista, Ph. D.
Associate Professor in Computer Science Engineering
EB Member of IEEE Communications and IEEE T. Services Computing
DEIS - Università degli Studi di Bologna
Viale Risorgimento, 2 - 40136 Bologna (ITALY)
Tel# +39-051-2093866; Fax# +39-051-2093073
Email: paolo.bellavista at unibo.it
Web: http://lia.deis.unibo.it/Staff/PaoloBellavista/  
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