[ecoop-info] [DSD2011] EUROMICRO DSD 2011 FIRST CALL FOR PAPERS

Paris Kitsos pkitsos at eap.gr
Mon Nov 8 17:23:17 CET 2010


===============================================================

DSD'2011 CALL FOR PAPERS

14th EUROMICRO CONFERENCE ON DIGITAL SYSTEM DESIGN

Architectures, Methods and Tools

Oulu, Finland, August 31 - September 2, 2011

http://dsmc2.eap.gr/dsd2011/

===============================================================

 

[IMPORTANT DATES]

 

- Submission of papers: March 14, 2011

- Notification of acceptance: April 24, 2011

- Camera ready papers: May 29, 2011

 

 

[SCOPE]

 

The Euromicro Conference on Digital System Design (DSD) addresses all
aspects of (embedded, pervasive and high-performance) digital and mixed
hardware/software system engineering, down to microarchitectures, digital
circuits and VLSI techniques. It is a discussion forum for researchers and
engineers from academia and industry working on state-of-the-art
investigations, development and applications. It focuses on advanced circuit
and system design and design automation concepts, paradigms, methods and
tools, as well as on modern implementation technologies from full custom in
nanometer technology nodes to FPGA and to multicore infrastructures.
Compiler assisted ASIP, CMP, SMP, SMT, DSP-VLIW, GPU and platform based
system design research results are welcome. Design and Verification
Languages and Standards, High Level Synthesis, Efficiency, Density, Signal
Integrity, Testability, Timing Analysis and Timing Closure, Asynchronous
Techniques, Reconfigurable Architectures, Power Consumption, Computational
Power Speed and Performance, Productive Design Technology and Engineering
Flows, Manufacturability, Cost, Reliability, Error Resilience, Complexity,
or Process Variability issues, Modeling, Design Experiences are covered in
DSD. 

The IEEE Conference Publishing Services (CPS), publishes the DSD
Proceedings, which are available worldwide through the IEEE Xplore Digital
Library. An extended version of the best papers will be published in a
special issue of the ISI-indexed Microprocessors and Microsystems: Embedded
Hardware Design journal, printed by Elsevier.

 

[MAIN TOPICS]

 

T1: (SHES) - System, hardware and embedded software design and automatic
synthesis: high-level, behavioral, register-transfer, logic and physical
circuit synthesis; arithmetic, signal processing and vector processing
units; graphics processing units and hardware accelerators; memory design;
communication architecture and protocols; specific circuits and processors;
multi-objective optimization observing power, performance, communication
traffic, interconnect architecture, layout, technology, reliability,
robustness, security, testability and other issues; management of parallel
computational resources, memory allocation and hierarchy; hardware/software
co-design; mapping of applications to architectures; algorithm architecture
matching; transaction level modeling and higher-level modeling; virtual
system prototyping; design space exploration; synthesis of asynchronous and
dataflow driven systems, nanoelectronics; CAD for placement, routing,
retiming, logic optimization, technology mapping, system-level partitioning,
logic generators, testing and verification; CAD for modeling, analysis and
optimization of timing and power.. 

 

T2: (SoC & NoC) - Systems-on-a-chip and networks-on-a-chip: multiprocessor
systems on-a-chip (MPSoC), generic system platforms and platform-based
design; CMP, SMP, SMT, DSP, VLIW and ASIP (multi)processor architectures and
enhancements; 3D MPSoCs; software design and programming models for
multicore platforms; benchmarks; GPUs; cell-based platforms; NoC
architectural issues, quality of service in NoCs; 3D NoCs; power dissipation
and energy issues in SoCs and NoCs; IP design, standardization and reuse;
parallelism and scalability techniques; virtual components; system on a
system; compiler assisted MPSoC; hardware support for embedded kernels;
embedded software features; static, run-time and dynamic optimizations of
embedded systems. 

 

T3: (RC) - Programmable/re-configurable/adaptable architectures: design
methodologies and tools for reconfigurable computing, run-time, partial and
dynamic reconfigurability; fine-grained, mixed-grained and coarse-grained
reconfigurable architectures; reconfigurable interconnections and NoCs;
FPGAs; systems on re-configurable chip; system FPGAs and structured ASICs
and co-processors; processing arrays; programmable fabrics; novel logic
block architectures, combination of FPGA fabric and system blocks (DSP,
processors, memories, etc.); adaptive computing devices, systems and
software; adaptable ASIPs and ASIP-based SOCs, hardware accelerators;
optimization of FPGA-based cores; shared resource management; novel design
algorithms for FPGA features; high-level models and tools for FPGAs; rapid
prototyping systems and platforms; wireless and mobile systems. 

 

T4: (SMVT) - System, hardware and embedded-software specification, modeling,
verification and test: design, modeling, simulation and verification
languages; functional, structural and parametric specification and modeling,
model-based design and verification; system, hardware, and embedded software
analysis; simulation, emulation, prototyping, formal verification,
design-for-test and testing at all design levels; dependability and
fault-tolerance issues. 

 

T5: (APP) - Applications of (embedded) digital systems: emphasis on design
challenges posed by demanding and new applications in fields such as:
(wireless) communication and networking; networked electronic media,
multimedia and ambient intelligence; image and video processing; mobile
systems; health-care and medicine; ubiquitous, wearable and implanted
systems; military, space, avionics, measurement, control and automotive
applications; wireless sensor network applications; surveillance and
security; environmental, agriculture, urban, building, transportation,
traffic, energy, hazards and disasters monitoring and control. 

 

T6: (ET) - Important issues introduced by emerging technologies: issues for
the system, circuit and embedded software design introduced by e.g. the
nanometer CMOS and beyond CMOS technologies, 3D integration, optical and new
memory technologies etc.; new human-machine interfaces, neural- and
bio-computation, (bio)sensor and sensor network technologies, pervasive and
ubiquitous computing, 'internet of things'; design methods and EDA tools for
solving these issues. 

 

[SPECIAL SESSIONS]

 

Special sessions already accepted. 

-              SS1: (FDR) - Flexible Digital Radio.

-              SS2: (MSDA) - Multicore Systems: Design and Applications.

-              SS3: (DTDS) - Dependability and Testing of Digital Systems.

-              SS4: (FTDSD) - Fault Tolerance in Digital System Design.

-              SS5: (SLEO) - System-Level Energy Optimization of HW/SW
Embedded Systems.

-              SS6: (WSN) - Wireless Sensor Networks.

-              SS7: (AHSA) - Architectures and Hardware for Security
Applications.

 

[PROPOSAL FOR NEW SPECIAL SESSIONS]

 

DSD 2011 will include additional special sessions focused on hot topics and
emerging fields of interest to the digital systems design research
community.  Proposals for special sessions must include a title, contact
information for the session chair(s), and a list of authors who have been or
will be contacted to present papers if the session is accepted. Proposals
for new special sessions should be submitted to the Program Chair
(pkitsos at eap.gr) before January 7, 2011.

 

[SUBMISSION GUIDELINES]

 

Regular Papers: Prospective authors are encouraged to submit their
manuscripts for review electronically through the following web page
(https://www.conftool.net/dsd2011/) or by sending the paper to the Program
Chair via email (pkitsos at eap.gr, only if an unexpected web access problem is
encountered) before the deadline for submission. Each manuscript should
include the complete paper text, all illustrations, and references. The
manuscript should conform to the required IEEE format: single-spaced, double
column, A4/US letter page size, 10-point size Times Roman font, up to 8
pages. In order to conduct a blind review, no indication of the authors'
names should appear in the submitted manuscript, references included.

 

Case Studies and Application Papers: Submissions can be made which report on
state-of-the-art digital systems, digital designs, architectures, design
methods and/or tools, and (embedded) applications. Papers discussing lessons
learned from practical experience, demanding or new applications, and
experimental research are particularly encouraged. Manuscripts may be
submitted in the same way as regular papers.

 

[CONFERENCE COMMITTEES]

 

DSD STEERING COMMITTEE:

Chairman: Lech Jozwiak, Eindhoven U. of Tech. (NL)

Krzysztof Kuchcinski, Lund U. (SE)

Antonio Nunez, IUMA/U. Las Palmas GC (ES)

 

DSD11 GENERAL CHAIR:

Pekka Abrahamsson, University of Helsinki, (FI)

 

DSD11 PROGRAM COMMITTEE CHAIR:

Program Chairman: Paris Kitsos, Hellenic Open Univ., (GR)

Deputy Program Chairman: Smail Niar, U. Lille North France, Valencienne,
(FR)

 

DSD11 LOCAL ORGANIZING CHAIR:

Chair: Pasi Kuvaja, University of Oulu, (FI)

 

DSD11 PROGRAM COMMITTEE:

 

A. Akkas, St. Cloud State U., (US)

A. Lastovetsky, University College Dublin, (IR) 

A. Nunez, IUMA/U. of Las Palmas G.C., (ES)

A. Orailoglu, U. of California, San Diego, (US)

A. Pawlak, ITE & SUT, (PL)

A. Postula, U. of Queensland, (AU)

A. Shrivastava, Arizona State U., (US)

B. Juurlink, TU Berlin (DE)

C. Bouganis, Imperial College, (UK)

C. Cornelius, U. of Rostock, (DE)

C. Wolinski, IRISA, Rennes, (FR)

D. Houzet, Grenoble Institute of Technology, (FR)

D. Noguet, Minatec CEA-LETI, (FR)

D. Quaglia, U. of Verona, (IT)

E. Martins, U. of Aveiro, (PT)

F. Leporati, U. of Pavia, (IT)

G. Danese, U. Of Pavia, (IT)

H. Basson, U. of Littoral, (FR)

H. Kubatova, CTU Prague, (CZ)

H.T. Vierhaus, Brandenburg U. of Tech., (DE)

I. Hamzaoglu, Sabanci U., (TK)

J. Haid, Infineon Technologies, (AT)

J. Rabaey, U. of California, Berkeley, (US)

J. Sahuquillo, Pol. U. of Valencia, (ES)

J. Tiberghien, U. Libre de Bruxelles, (BE)

J.L. Dekeyser, U. of Lille, (FR)

J.S. Matos, U. of Porto, (PT)

K. Kent, U. of New Brunswick, (CA)

K. Kuchcinski, Lund U., (SE)

K. Popovici, Mathworks Inc., (US)

L. Benini, U. of Bologna, (IT)

L. Fanucci, U. of Pisa, (IT)

L. Jozwiak, Eindh. U. of Tech., (NL)

L. Sousa, U. of Lisboa, (PT)

L.-G. Chen, National Taiwan U., (TW)

M. Berekovic, TU Braunschweig (DE)

M. Figueroa, U. of Concepcion, (CL)

M. K. Michail, U. of Cyprus, (CY)

M. Perkowski, Portland St. U., (US)

M. Valero, Pol. U. of Catalunya, (ES)

M. Velev, Aries Design Automation, (US)

N. Dutt, U. of Calif., Irvine, (US)

N. Nedjah, State U. of Rio de Janeiro, (BR)

N. Sklavos, Tech. Inst. Patras, (GR)

O. Koufopavlou, U. Patras, (GR)

P. Carballo, IUMA/U. of Las Palmas GC, (ES)

P. Kitsos, Hellenic Open U., (GR)

P. Schumacher, Xilinx Inc., (US)

R. Drechsler, U. of Bremen, (DE)

R. Cumplido, INAOE, (MX)

R. Ubar, Tallinn Tech. U., (EE)

S. Kumar, Jonkoping U., (SE)

S. Lopez, IUMA/U. of Las Palmas G.C., (ES)

S. Niar, U. Valenciennes, (FR)

S. Vitabile, U. of Palermo, (IT)

T. El-Ghazawi, George Washington U., (US)

T. Luba, Warsaw U. of Tech., (PL)

T. Sasao, Kyushu Ins. of Tech., (JP)

V. Muthukumar, U. of Nevada Las Vegas, (US)

V. Prasanna, U. of Southern California, (US)

W. Luk, Imperial College, (UK)

W. Stechele, Technical U. Munich, (DE)

Z. Kotasek, Brno U. of Tech., (CZ)

 

DSD permanent homepage is at:

http://www.ics.ele.tue.nl/~dsd/

Euromicro homepage is at:

http://www.euromicro.org/

===============================================================

-------------- next part --------------
An HTML attachment was scrubbed...
URL: http://web.satd.uma.es/pipermail/ecoop-info/attachments/20101108/66974f62/attachment-0001.html 


More information about the ecoop-info mailing list