[ecoop-info] URGENT: DSD'2011 DEADLINE EXTENDED UNTIL March 21st

[Paris Kitsos]

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*URGENT: DSD'2011 DEADLINE EXTENDED UNTIL March 21st!!!*
14th EUROMICRO CONFERENCE ON DIGITAL SYSTEM DESIGN
Architectures, Methods and Tools
Oulu, Finland, August 31 -- September 2, 2011
http://dsmc2.eap.gr/dsd2011/
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[IMPORTANT DATES]

- Submission of papers:*EXTENDED UNTIL March 21, 2011 *
- Notification of acceptance: April 24, 2011
- Camera ready papers: May 29, 2011

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"Due to an extraordinary situation in several countries (e.g. Japan) an 
additional extension is possible on request."
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[SCOPE]

The Euromicro Conference on Digital System Design (DSD) addresses all 
aspects of (embedded, pervasive and high-performance) digital and mixed 
hardware/software system engineering, down to microarchitectures, 
digital circuits and VLSI techniques. It is a discussion forum for 
researchers and engineers from academia and industry working on 
state-of-the-art investigations, development and applications. It 
focuses on advanced circuit and system design and design automation 
concepts, paradigms, methods and tools, as well as on modern 
implementation technologies from full custom in nanometer technology 
nodes to FPGA and to multicore infrastructures. Compiler assisted ASIP, 
CMP, SMP, SMT, DSP-VLIW, GPU and platform based system design research 
results are welcome. Design and Verification Languages and Standards, 
High Level Synthesis, Efficiency, Density, Signal Integrity, 
Testability, Timing Analysis and Timing Closure, Asynchronous 
Techniques, Reconfigurable Architectures, Power Consumption, 
Computational Power Speed and Performance, Productive Design Technology 
and Engineering Flows, Manufacturability, Cost, Reliability, Error 
Resilience, Complexity, or Process Variability issues, Modeling, Design 
Experiences are covered in DSD.
The IEEE Conference Publishing Services (CPS), publishes the DSD 
Proceedings, which are available worldwide through the IEEE Xplore 
Digital Library. An extended version of the best papers will be 
published in a special issue of the ISI-indexed Microprocessors and 
Microsystems: Embedded Hardware Design journal, printed by Elsevier.

[MAIN TOPICS]

T1: (SHES) - System, hardware and embedded software design and automatic 
synthesis: high-level, behavioral, register-transfer, logic and physical 
circuit synthesis; arithmetic, signal processing and vector processing 
units; graphics processing units and hardware accelerators; memory 
design; communication architecture and protocols; specific circuits and 
processors; multi-objective optimization observing power, performance, 
communication traffic, interconnect architecture, layout, technology, 
reliability, robustness, security, testability and other issues; 
management of parallel computational resources, memory allocation and 
hierarchy; hardware/software co-design; mapping of applications to 
architectures; algorithm architecture matching; transaction level 
modeling and higher-level modeling; virtual system prototyping; design 
space exploration; synthesis of asynchronous and dataflow driven 
systems, nanoelectronics; CAD for placement, routing, retiming, logic 
optimization, technology mapping, system-level partitioning, logic 
generators, testing and verification; CAD for modeling, analysis and 
optimization of timing and power..

T2: (SoC & NoC) - Systems-on-a-chip and networks-on-a-chip: 
multiprocessor systems on-a-chip (MPSoC), generic system platforms and 
platform-based design; CMP, SMP, SMT, DSP, VLIW and ASIP 
(multi)processor architectures and enhancements; 3D MPSoCs; software 
design and programming models for multicore platforms; benchmarks; GPUs; 
cell-based platforms; NoC architectural issues, quality of service in 
NoCs; 3D NoCs; power dissipation and energy issues in SoCs and NoCs; IP 
design, standardization and reuse; parallelism and scalability 
techniques; virtual components; system on a system; compiler assisted 
MPSoC; hardware support for embedded kernels; embedded software 
features; static, run-time and dynamic optimizations of embedded systems.

T3: (RC) - Programmable/re-configurable/adaptable architectures: design 
methodologies and tools for reconfigurable computing, run-time, partial 
and dynamic reconfigurability; fine-grained, mixed-grained and 
coarse-grained reconfigurable architectures; reconfigurable 
interconnections and NoCs; FPGAs; systems on re-configurable chip; 
system FPGAs and structured ASICs and co-processors; processing arrays; 
programmable fabrics; novel logic block architectures, combination of 
FPGA fabric and system blocks (DSP, processors, memories, etc.); 
adaptive computing devices, systems and software; adaptable ASIPs and 
ASIP-based SOCs, hardware accelerators; optimization of FPGA-based 
cores; shared resource management; novel design algorithms for FPGA 
features; high-level models and tools for FPGAs; rapid prototyping 
systems and platforms; wireless and mobile systems.

T4: (SMVT) - System, hardware and embedded-software specification, 
modeling, verification and test: design, modeling, simulation and 
verification languages; functional, structural and parametric 
specification and modeling, model-based design and verification; system, 
hardware, and embedded software analysis; simulation, emulation, 
prototyping, formal verification, design-for-test and testing at all 
design levels; dependability and fault-tolerance issues.

T5: (APP) - Applications of (embedded) digital systems: emphasis on 
design challenges posed by demanding and new applications in fields such 
as: (wireless) communication and networking; networked electronic media, 
multimedia and ambient intelligence; image and video processing; mobile 
systems; health-care and medicine; ubiquitous, wearable and implanted 
systems; military, space, avionics, measurement, control and automotive 
applications; wireless sensor network applications; surveillance and 
security; environmental, agriculture, urban, building, transportation, 
traffic, energy, hazards and disasters monitoring and control.

T6: (ET) - Important issues introduced by emerging technologies: issues 
for the system, circuit and embedded software design introduced by e.g. 
the nanometer CMOS and beyond CMOS technologies, 3D integration, optical 
and new memory technologies etc.; new human-machine interfaces, neural- 
and bio-computation, (bio)sensor and sensor network technologies, 
pervasive and ubiquitous computing, 'internet of things'; design methods 
and EDA tools for solving these issues.

[SPECIAL SESSIONS]

?    SS1: (FDR) - Flexible Digital Radio.
?    SS2: (MSDA) - Multicore Systems: Design and Applications.
?    SS3: (DTDS) - Dependability and Testing of Digital Systems.
?    SS4: (FTDSD) - Fault Tolerance in Digital System Design.
?    SS5: (SLEO) - System-Level Energy Optimization of HW/SW Embedded 
Systems.
?    SS6: (WSN) - Wireless Sensor Networks.
?    SS7: (AHSA) - Architectures and Hardware for Security Applications.
?    SS8: (M2APS) - Monitoring Methods for Adaptive Parallel Systems.

More information on special sessions: 
http://dsmc2.eap.gr/dsd2011/index.php?page=8

[SUBMISSION GUIDELINES]

Regular Papers: Prospective authors are encouraged to submit their 
manuscripts for review electronically through the following web page 
(https://www.conftool.net/dsd2011/) or by sending the paper to the 
Program Chair via email (pkitsos at eap.gr, only if an unexpected web 
access problem is encountered) before the deadline for submission. Each 
manuscript should include the complete paper text, all illustrations, 
and references. The manuscript should conform to the required IEEE 
format: single-spaced, double column, A4/US letter page size, 10-point 
size Times Roman font, up to 8 pages. In order to conduct a blind 
review, no indication of the authors' names should appear in the 
submitted manuscript, references included.

Case Studies and Application Papers: Submissions can be made which 
report on state-of-the-art digital systems, digital designs, 
architectures, design methods and/or tools, and (embedded) applications. 
Papers discussing lessons learned from practical experience, demanding 
or new applications, and experimental research are particularly 
encouraged. Manuscripts may be submitted in the same way as regular papers.

[CONFERENCE COMMITTEES]

DSD STEERING COMMITTEE:
Chairman: Lech Jozwiak, Eindhoven U. of Tech. (NL)
Krzysztof Kuchcinski, Lund U. (SE)
Antonio Nunez, IUMA/U. Las Palmas GC (ES)

DSD11 GENERAL CHAIR:
Pekka Abrahamsson, University of Helsinki, (FI)

DSD11 PROGRAM COMMITTEE CHAIR:
Program Chairman: Paris Kitsos, Hellenic Open Univ., (GR)
Deputy Program Chairman: Smail Niar, U. Lille North France, Valencienne, 
(FR)

DSD11 LOCAL ORGANIZING CHAIR:
Chair: Pasi Kuvaja, University of Oulu, (FI)

DSD11 PROGRAM COMMITTEE:

A. Akkas, St. Cloud State U., (US)
A. Lastovetsky, University College Dublin, (IR)
A. Nunez, IUMA/U. of Las Palmas G.C., (ES)
A. Orailoglu, U. of California, San Diego, (US)
A. Pawlak, ITE & SUT, (PL)
A. Postula, U. of Queensland, (AU)
A. Shrivastava, Arizona State U., (US)
B. Juurlink, TU Berlin (DE)
C. Bouganis, Imperial College, (UK)
C. Cornelius, U. of Rostock, (DE)
C. Wolinski, IRISA, Rennes, (FR)
D. Houzet, Grenoble Institute of Technology, (FR)
D. Noguet, Minatec CEA-LETI, (FR)
D. Quaglia, U. of Verona, (IT)
E. Martins, U. of Aveiro, (PT)
F. Leporati, U. of Pavia, (IT)
G. Danese, U. Of Pavia, (IT)
H. Basson, U. of Littoral, (FR)
H. Kubatova, CTU Prague, (CZ)
H.T. Vierhaus, Brandenburg U. of Tech., (DE)
I. Hamzaoglu, Sabanci U., (TK)
J. Haid, Infineon Technologies, (AT)
J. Rabaey, U. of California, Berkeley, (US)
J. Sahuquillo, Pol. U. of Valencia, (ES)
J. Tiberghien, U. Libre de Bruxelles, (BE)
J.L. Dekeyser, U. of Lille, (FR)
J.S. Matos, U. of Porto, (PT)
K. Kent, U. of New Brunswick, (CA)
K. Kuchcinski, Lund U., (SE)
K. Popovici, Mathworks Inc., (US)
L. Benini, U. of Bologna, (IT)
L. Fanucci, U. of Pisa, (IT)
L. Jozwiak, Eindh. U. of Tech., (NL)
L. Sousa, U. of Lisboa, (PT)
L.-G. Chen, National Taiwan U., (TW)
M. Berekovic, TU Braunschweig (DE)
M. Figueroa, U. of Concepcion, (CL)
M. K. Michail, U. of Cyprus, (CY)
M. Perkowski, Portland St. U., (US)
M. Valero, Pol. U. of Catalunya, (ES)
M. Velev, Aries Design Automation, (US)
N. Dutt, U. of Calif., Irvine, (US)
N. Nedjah, State U. of Rio de Janeiro, (BR)
N. Sklavos, Tech. Inst. Patras, (GR)
O. Koufopavlou, U. Patras, (GR)
P. Carballo, IUMA/U. of Las Palmas GC, (ES)
P. Kitsos, Hellenic Open U., (GR)
P. Schumacher, Xilinx Inc., (US)
R. Drechsler, U. of Bremen, (DE)
R. Cumplido, INAOE, (MX)
R. Ubar, Tallinn Tech. U., (EE)
S. Kumar, Jonkoping U., (SE)
S. Lopez, IUMA/U. of Las Palmas G.C., (ES)
S. Niar, U. Valenciennes, (FR)
S. Vitabile, U. of Palermo, (IT)
T. El-Ghazawi, George Washington U., (US)
T. Luba, Warsaw U. of Tech., (PL)
T. Sasao, Kyushu Ins. of Tech., (JP)
V. Muthukumar, U. of Nevada Las Vegas, (US)
V. Prasanna, U. of Southern California, (US)
W. Luk, Imperial College, (UK)
W. Stechele, Technical U. Munich, (DE)
Y. Qu, Renesas Mobile, (FI)
Z. Kotasek, Brno U. of Tech., (CZ)


DSD permanent homepage is at:
http://www.ics.ele.tue.nl/~dsd/
US mirror:
http://www.dsdconf.org/
Euromicro homepage is at:
http://www.euromicro.org/
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