[ecoop-info] CFP: SLE 2020 - 13th ACM SIGPLAN International Conference on Software Language Engineering

Loli Burgueño lburguenoc at uoc.edu
Thu May 21 12:03:30 CEST 2020


13th ACM SIGPLAN International Conference on Software Language Engineering
(SLE 2020)

November 15-20, 2020

Chicago, Illinois, United States



We are pleased to invite you to submit papers to the 13th ACM SIGPLAN
International Conference on Software Language Engineering (SLE 2020), held
in conjunction with SPLASH, GPCE and SAS 2020 in Chicago, Illinois, on
November 15-20, 2020.


The ACM SIGPLAN International Conference on Software Language Engineering
(SLE) is devoted to the principles of software languages: their design,
their implementation, and their evolution.

With the ubiquity of computers, software has become the dominating
intellectual asset of our time. In turn, this software depends on software
languages, namely the languages it is written in, the languages used to
describe its environment, and the languages driving its development
process. Given that everything depends on software and that software
depends on software languages, it seems fair to say that for many years to
come, everything will depend on software languages.

Software language engineering (SLE) is the discipline of engineering
languages and their tools required for the creation of software. It
abstracts from the differences between programming languages, modelling
languages, and other software languages, and emphasizes the engineering
facet of the creation of such languages, that is, the establishment of the
scientific methods and practices that enable the best results. While SLE is
certainly driven by its metacircular character (software languages are
engineered using software languages), SLE is not self-satisfying: its scope
extends to the engineering of languages for all and everything.

Like its predecessors, the 13th edition of the SLE conference, SLE 2020,
will bring together researchers from different areas united by their common
interest in the creation, capture, and tooling of software languages. It
overlaps with traditional conferences on the design and implementation of
programming languages, model-driven engineering, and compiler construction,
and emphasizes the fusion of their communities. To foster the latter, SLE
traditionally fills a two-day program with a single track, with the only
temporal overlap occurring between co-located events.

Topics of Interest

SLE 2020 solicits high-quality contributions in areas ranging from
theoretical and conceptual contributions, to tools, techniques, and
frameworks in the domain of software language engineering.

Broadly speaking, SLE covers software language engineering rather than
engineering a specific software language. Topics of interest include, but
are not limited to:

* Software Language Design and Implementation
    - Approaches to and methods for language design
    - Static semantics (e.g. design rules, well-formedness constraints)
    - Techniques for specifying behavioral / executable semantics
    - Generative approaches (incl. code synthesis, compilation)
    - Meta-languages, meta-tools, language workbenches
* Software Language Validation
    - Verification and formal methods for languages
    - Testing techniques for languages
    - Simulation techniques for languages
* Software Language Integration and Composition
    - Coordination of heterogeneous languages and tools
    - Mappings between languages (incl. transformation languages)
    - Traceability between languages
    - Deployment of languages to different platforms
* Software Language Maintenance
    - Software language reuse
    - Language evolution
    - Language families and variability
* Domain-specific approaches for any aspects of SLE (design,
implementation, validation, maintenance)
* Empirical evaluation and experience reports of language engineering tools
    - User studies evaluating usability
    - Performance benchmarks
    - Industrial applications

Important Dates

All dates are Anywhere on Earth.

* Mon 20 Jul 2020 - Abstract Submission
* Mon 27 Jul 2020 - Paper Submission
* Wed Sept 9th 2020 - Author Notification
* Wed Sep 16th 2020 - Artifact Submission
* Mon 12 Oct 2020 - Camera ready deadline
* Mon 26 Oct 2020 - Artifact notification
* Sun 15 Nov - Fri 20 Nov 2020 - SLE Conference

Types of Submissions

* Research papers:
These are "traditional" papers detailing research contributions to SLE.
These papers have a limit of 12 pages, and may optionally include 8 further
pages of bibliography/appendices

* Tool papers:
These are papers which focus on the tooling aspects which are often
forgotten or neglected in research papers. A good tool paper focuses on
practical insights that are likely to be useful to other implementers or
users in the future. Any of the SLE topics of interest are appropriate
areas for tool demonstrations. Submissions must not exceed 5 pages and may
optionally include 1 further page of bibliography / appendices. They may
optionally come with an appendix with a demo outline / screenshots and/or a
short video/screencast illustrating the tool. Tool paper titles must start
with "Tool Demo:".

* New ideas / vision papers:
These are forward-looking papers about ideas that will interest the SLE
community but which are not currently at an advanced level of research.
These might be about new research avenues or about integrating existing
research ideas, or technologies. New ideas / vision papers must not exceed
5 pages, and may optionally include 1 further page of bibliography /

Artifact Evaluation

For the fifth year SLE will use an evaluation process for assessing the
quality of the artifacts on which papers are based to foster the culture of
experimental reproducibility. Authors of accepted papers are invited to
submit artifacts. For more information, please have a look at the Artifact
Evaluation page: http://www.sleconf.org/2020/ArtifactEvaluation.html


Submissions have to use the ACM SIGPLAN Conference Format "acmart" (
http://sigplan.org/Resources/Author/#acmart-format); please make sure that
you always use the latest ACM SIGPLAN acmart LaTeX template (
and that the document class definition is
\documentclass[sigplan,anonymous,review]{acmart}. Do not make any changes
to this format!

Ensure that your submission is legible when printed on a black and white
printer. In particular, please check that colors remain distinct and font
sizes in figures and tables are legible.

To increase fairness in reviewing, a double-blind review process has become
standard across SIGPLAN conferences. In this line, SLE will follow the
double-blind process. Author names and institutions should be omitted from
submitted papers, and references to the authors’ own related work should be
in the third person. No other changes are necessary, and authors will not
be penalized if reviewers are able to infer their identities in implicit

All submissions must be in PDF format.

Concurrent Submissions:
Papers must describe unpublished work Papers must describe unpublished work
that is not currently submitted for publication elsewhere as described by
SIGPLAN’s Republication Policy (
http://www.sigplan.org/Resources/Policies/Republication). Submitters should
also be aware of ACM’s Policy and Procedures on Plagiarism (
http://www.acm.org/publications/policies/plagiarism_policy). Submissions
that violate these policies will be desk-rejected.

Submission Site:
Submissions will be accepted at https://sle20.hotcrp.com/

Reviewing Process

All submitted papers will be reviewed by at least three members of the
program committee. Research papers and tool papers will be evaluated
concerning novelty, correctness, significance, readability, and alignment
with the conference call. New ideas / vision papers will be evaluated
primarily concerning novelty, significance, readability, and alignment with
the conference call.

For fairness reasons, all submitted papers must conform to the above
instructions. Submissions that violate these instructions may be rejected
without review, at the discretion of the PC chairs.


* Distinguished paper: Award for most notable paper, as determined by the
PC chairs based on the recommendations of the programme committee.

* Distinguished reviewer: Award for distinguished reviewer, as determined
by the PC chairs.

* Distinguished artifact: Award for the artifact most significantly
exceeding expectations, as determined by the AEC chairs based on the
recommendations of the artifact evaluation committee.


All accepted papers will be published in the ACM Digital Library.

The official publication date is the date the proceedings are made
available in the ACM Digital Library. This date may be up to two weeks
prior to the first day of the conference. The official publication date
affects the deadline for any patent filings related to published work.

Program Committee

Jonathan Aldrich, CMU, USA
Uwe Assmann, TU Dresden, Germany
Olivier Barais, “Univ. Rennes, Inria, CNRS, IRISA”, France
Artur Boronat, University of Leicester, UK
Erwan Bousse, University of Nantes, France
Javier Canovas, UOC - IN3, Spain
Walter Cazzola, University of Milan, Italy
Marsha Chechik, University of Toronto, Canada
Tony Clark, Aston University, UK
Sebastian Erdweg, JGU Mainz, Germany
Jeff Gray, University of Alabama, USA
Görel Hedin, Lund University, Sweden
Dimitris Kolovos, University of York, UK
Padmanabhan Krishnan, Oracle Labs, Australia
Thomas Kühne, Victoria University of Wellington, New Zealand
Sérgio Queiroz de Medeiros, Universidade Federal do Rio Grande do Norte,
Iris Reinhartz-Berger, University of Haifa, Israel
Bernhard Rumpe, RWTH Aachen University, Germany
Yann Régis-Gianas, IRIF - INRIA, France
Elizabeth Scott, Royal Holloway University of London, UK
Chris Seaton, Shopify, UK
Friedrich Steimann, Fernuniversität in Hagen, Germany
Tijs van der Storm, CWI, Netherlands
Eugene Syriani, Université de Montréal, Canada
Jesús Sánchez Cuadrado, University of Murcia, Spain
Eric Van Wyk, University of Minnesota, USA
Markus Voelter, independent/itemis
Vadim Zaytsev, Raincode Labs, Belgium
Uwe Zdun, University of Vienna, Austria


For additional information, clarification, or answers to questions, please
contact the Programme Chairs (Juan de Lara and Laurence Tratt) by email (
Juan.deLara at uam.es and laurie at tratt.net).



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