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<P style="MARGIN: 0cm 0cm 0pt" class=MsoNormal><FONT size=2 face="Courier New, Courier, mono"><STRONG> *** CALL FOR PAPERS ***<BR> 27th IEEE International SoC Conference (SOCC2014)<BR> September 3–5, 2014<BR> Las Vegas, Nevada, USA</STRONG></FONT></P>
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<P style="MARGIN: 0cm 0cm 0pt" class=MsoNormal><FONT size=2 face="Courier New, Courier, mono">The IEEE SoC Conference (SOCC) is a premier forum for sharing advances in SoC<BR>technologies and applications in the areas of digital systems, circuit architectures, <BR>computing platforms, design methods, automations, test, and emerging technologies. <BR>SOCC2014 offers a three-day technical program including keynote and plenary speeches, <BR>oral and poster presentations, hot-topic panel sessions and tutorials, and exhibitions. <BR>This year the SOCC introduces a “Design Track” to encourage engineers to present their <BR>work and share their knowledge and experience on issues and practical solutions in the <BR>development of SoC designs. SOCC2014 also provides a high quality social events program, <BR>including a Las Vegas show, conference banquet, and a tour of the cavernous powerhouse <BR>of Hoover Dam hydro-electric plant. Contact us: </FONT><A href="mailto:info@ieee-socc.org"><FONT size=2 face="Courier New, Courier, mono">info@ieee-socc.org</FONT></A></P>
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<P style="MARGIN: 0cm 0cm 0pt" class=MsoNormal><FONT size=2 face="Courier New, Courier, mono"><STRONG>SUBMISSION OF PAPERS AND WORKSHOP/TUTORIAL/SPECIAL SESSION PROPOSALS</STRONG> </FONT></P>
<P style="MARGIN: 0cm 0cm 0pt" class=MsoNormal><FONT size=2 face="Courier New, Courier, mono">Online paper submissions are in pdf format, limited to six double-column IEEE format<BR>pages. Paper submissions will go through a double-blind peer review process. The SOCC<BR>proceedings will be submitted to IEEE Xplore®. Workshop/tutorial proposals with title, <BR>a one-page summary, and speaker’s short bio are submitted to the Tutorial Chair. Special<BR>session proposals may include title, topic rationale, organizer’s short bio, and a list <BR>of contributed papers, which are submitted to the TPC Chairs. “Design Track” submissions<BR>require a two-page extended abstract which will be published on the SOCC website and in<BR>the program. For detailed formatting instructions and submission guidelines, please refer to<BR></FONT><A href="http://www.ieee-socc.org"><FONT size=2 face="Courier New, Courier, mono">www.ieee-socc.org</FONT></A><FONT size=2 face="Courier New, Courier, mono">..</FONT></P>
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<P style="MARGIN: 0cm 0cm 0pt" class=MsoNormal><FONT face="Courier New, Courier, mono"><FONT size=2><STRONG>SOCC AREAS OF INTEREST</STRONG><BR>Papers are invited which address new and previously unpublished results in <BR>the areas:<BR> • Analog and Mixed-Signal Circuits and Systems<BR> • Biomedical Circuits and Systems<BR> • Wireline and Wireless Communication Circuits and Systems<BR> • Digital Signal Processing (DSP) Circuits and Systems<BR> • Low-Power, Green Circuits, Systems, and Design Methodologies<BR> • Embedded Systems, Multi/Many Core Systems and Embedded Memory Technologies<BR> • Network on Chip (NoC), Interconnects, and 3D-IC<BR> • Reconfigurable and Programmable Circuits and Systems<BR> • System Level Design Methodology and tools<BR> • Design for Testability and Manufacturability<BR> • Design Verification<BR> • MEMS and Emerging Technologies</FONT></FONT></P>
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<P style="MARGIN: 0cm 0cm 0pt" class=MsoNormal><FONT face="Courier New, Courier, mono"><FONT size=2><STRONG>KEY DATES</STRONG><BR> Special session proposal submission deadline: March 10th, 2014<BR> Regular paper submission deadline: March 31st, 2014<BR> Workshop/tutorial proposal submission deadline: April 8th, 2014<BR> Design Track extended abstract due: April 14th, 2014<BR> Notification of acceptance: June 10th, 2014<BR> Final camera?ready paper due: June 30th, 2014</FONT></FONT></P>
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<P style="MARGIN: 0cm 0cm 0pt" class=MsoNormal><FONT face="Courier New, Courier, mono"><FONT size=2><STRONG>ORGANIZING COMMITTEE</STRONG><BR> Conference General Chair: Kaijian Shi, Cadence Design Systems<BR> Technical Program Chair: Thomas Buechner, IBM<BR> Technical Program Co-Chair: Danella Zhao, Univ. of Louisiana at Lafayette<BR> Financial Chair: Ramalingam Sridhar, SUNY at Buffalo<BR> Tutorial Chair: Yuejian Wu, Infinera<BR> Publicity Chair: Nagi Naganathan, LSI<BR> Sponsorship/Exhibition Chair: Karan Bhatia, Texas Instruments<BR> Local OC Chair: Venki Muthukumar, Univ. of Nevada Las Vegas<BR> Steering Committee Chair: Norbert Schuhmann Fraunhofer IIS<BR> Europe Liaison: Sakir Sezer, Queen’s Univ. Bellfast<BR> Asia Liaison: Sao-Jie Chen, National Taiwan University</FONT></FONT></P>
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