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<div>* apologies for cross-posting *</div>
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<div> DAIS</div>
<div> 14th IFIP International Conference on</div>
<div> Distributed Applications and Interoperable Systems</div>
<div> http://dais.discotec.org/</div>
<div>June 3-6, 2014, Berlin, Germany</div>
<div><br>
</div>
<div>* Important Dates *</div>
<div><br>
</div>
<div>1 February, 2014: Abstract submission</div>
<div>7 February, 2014: Paper submission</div>
<div>10 March, 2014: Notification to authors</div>
<div>24 March, 2014: Camera-ready version due</div>
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<div><br>
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<div>* Scope *</div>
<div><br>
</div>
<div>The annual IFIP DAIS conference is one of the leading international</div>
<div>venues to discuss all aspects of distributed applications and systems,</div>
<div>throughout their lifecycle. This includes the design, architecture,</div>
<div>implementation and operation of distributed computing systems, their</div>
<div>supporting middleware, appropriate software engineering methods and</div>
<div>tools, as well as experimental studies and practical reports.</div>
<div><br>
</div>
<div>Following the success of past conferences in this series, the 14th</div>
<div>International DAIS conference will provide a forum for researchers,</div>
<div>industry practitioners, and users, to discuss and learn about new</div>
<div>technologies, approaches, concepts and experiences in the field of</div>
<div>distributed computing.</div>
<div><br>
</div>
<div>Submission tracks: DAIS offers three distinct submission tracks</div>
<div>(Research papers, Practical Experience Reports, and</div>
<div>Work-in-progress papers). Authors should indicate in their submission</div>
<div>which track they are submitting to. All papers accepted in any of</div>
<div>the tracks will be included in the conference proceedings.</div>
<div><br>
</div>
<div>* Topics of Interest *</div>
<div><br>
</div>
<div>DAIS'14 solicits high-quality papers reporting research results and/or</div>
<div>experimental results in the area of distributed applications and</div>
<div>interoperable systems. Submissions will be judged on their originality,</div>
<div>significance, clarity, relevance, and technical correctness. The</div>
<div>topics of interest to the conference include, but are not limited to:</div>
<div> - Novel and innovative distributed applications and systems, in</div>
<div> particular in the areas of middleware, peer-to-peer systems,</div>
<div> cloud and grid computing, social networking, cyber-physical</div>
<div> systems, mobile computing, service-oriented computing, and</div>
<div> context-aware computing;</div>
<div> - Novel architectures and mechanisms, in particular in the areas of</div>
<div> pub/sub systems, language-based approaches, overlay network</div>
<div> protocols, virtualisation, parallelization, bio-inspired</div>
<div> distributed computing;</div>
<div> - System issues and design goals, including self-management,</div>
<div> trust and reputation, cooperation incentives and fairness,</div>
<div> fault-tolerance and dependability, energy-efficiency,</div>
<div> performance, robustness and scalability;</div>
<div> - Engineering and tools, including model-driven engineering,</div>
<div> domain-specific languages, design patterns and methods, testing</div>
<div> and validation, distributed debugging.</div>
<div><br>
</div>
<div>* Submission and Publication *</div>
<div><br>
</div>
<div>DAIS'14 offers three submission tracks:</div>
<div> - Full research papers with no more than 14 pages;</div>
<div> - Full practical experience reports, including experimental and </div>
<div> evaluation studies, case studies, and practice reports with no </div>
<div> more than 14 pages;</div>
<div> - Work-in-progress papers, describing ongoing work and interim</div>
<div> results, with no more than 6 pages. All papers must be</div>
<div> original, unpublished, and not submitted for publication</div>
<div> elsewhere.</div>
<div><br>
</div>
<div>Contributions should be submitted electronically as PDF using</div>
<div>the Springer LNCS style (http://www.springer.com/computer/lncs)</div>
<div>to the conference submission website:</div>
<div>https://www.easychair.org/conferences/?conf=dais2014</div>
<div><br>
</div>
<div>Each paper will undergo a thorough process of peer reviews by the</div>
<div>Program Committee. All papers accepted in any of the conference</div>
<div>tracks will be included in the conference proceedings, which will</div>
<div>be published by Springer-Verlag in the LNCS series. Proceedings</div>
<div>will be made available at the conference. Submission implies that</div>
<div>at least one author will register and attend the conference if the</div>
<div>paper is accepted.</div>
<div><br>
</div>
<div>* Program Committee Co-Chairs *</div>
<div><br>
</div>
<div>Kostas Magoutis, ICS-FORTH, Greece</div>
<div>Peter Pietzuch, Imperial College, UK</div>
<div><br>
</div>
<div>* Publication Chair * </div>
<div><br>
</div>
<div>Eva Kalyvianaki, City University London, UK</div>
<div><br>
</div>
<div>* Program Committee * </div>
<div><br>
</div>
<div>Stergios Anastasiadis, University of Ioannina, Greece</div>
<div>Cosmin Arad, Google, USA</div>
<div>Danilo Ardagna, Politecnico di Milano, Italy</div>
<div>Carlos Baquero, Universidade do Minho, Portugal</div>
<div>Gordon Blair, Lancaster University, UK</div>
<div>Wolfgang De Meuter, Vrije Universiteit Brussel, Belgium</div>
<div>Jim Dowling, KTH Royal Institute of Technology, Sweden</div>
<div>Frank Eliassen, University of Oslo, Norway</div>
<div>David Eyers, University of Otago, New Zealand</div>
<div>Paulo Ferreira, INESC ID / Technical University of Lisbon, Portugal</div>
<div>Kurt Geihs, Universitaet Kassel, Germany</div>
<div>Karl Goeschka, Vienna University of Technology, Austria</div>
<div>Franz Hauck, University of Ulm, Germany</div>
<div>Peter Herrmann, NTNU Trondheim, Norway</div>
<div>Eva Kalyvianaki, City University London, UK</div>
<div>Boris Koldehofe, University Of Stuttgart, Germany</div>
<div>Dejan Kostic, Institute IMDEA Networks, Spain</div>
<div>Reinhold Kroeger, Wiesbaden University of Applied Sciences, Germany</div>
<div>Benny Mandler, IBM Research, Israel</div>
<div>Rene Meier, Trinity College Dublin, Ireland</div>
<div>Hein Meling, University of Stavanger, Norway</div>
<div>Pietro Michiardi, Institut Eurecom, France</div>
<div>Alberto Montresor, University of Trento, Italy</div>
<div>Kiran Muniswamy-Reddy, Amazon, USA</div>
<div>Dirk Muthig, Lufthansa Systems, Germany</div>
<div>George Papadopoulos, University of Cyprus, Cyprus</div>
<div>Nikos Parlavantzas, INSA Rennes, France</div>
<div>Jose Pereira, INESC TEC & Univ. Minho, Portugal</div>
<div>Jayaram Radhakrishnan, HP Labs, USA</div>
<div>Etienne Riviere, University of Neuchatel, Switzerland</div>
<div>Giovanni Russello, University of Auckland, Australia</div>
<div>Lionel Seinturier, University Lille 1, France</div>
<div>Liuba Shrira, Brandeis University, USA</div>
<div>Francois Taiani, UniversitÈ de Rennes 1, France</div>
<div>Luis Veiga, Instituto Superior TÈcnico - UTL / INESC-ID Lisboa, Portugal</div>
<div>Spyros Voulgaris, VU University Amsterdam, The Netherlands</div>
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