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<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=2 face="Courier New, Courier, mono"><STRONG> *** FINAL CALL FOR PAPERS ***</STRONG></FONT></P>
<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=2 face="Courier New, Courier, mono"><STRONG> <FONT color=#ff0000>Extended </FONT></STRONG><FONT color=#ff0000><STRONG>Deadline: May 2nd 2014</STRONG><BR></FONT><STRONG> 27th IEEE International SoC Conference (SOCC2014)<BR> September 2–5, 2014</STRONG></FONT></P>
<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=2 face="Courier New, Courier, mono"><STRONG> Planet Hollywood Resort<BR> Las Vegas, Nevada,USA</STRONG></FONT></P>
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<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><BR><FONT size=2 face="Courier New, Courier, mono">The IEEE SoC Conference (SOCC) is a premier forum for sharing advances in SoC </FONT></P>
<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=2 face="Courier New, Courier, mono">technologies and applications in the areas of digital systems, circuit architectures,</FONT></P>
<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=2 face="Courier New, Courier, mono">computing platforms, design methods, automations, test, and emerging technologies. </FONT></P>
<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=2 face="Courier New, Courier, mono">SOCC2014 offers a four-day technical program, which features:</FONT></P>
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<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=2 face="Courier New, Courier, mono"> • Keynote and Plenary Speakers <BR> - <STRONG>Tom Beckley</STRONG> (Sr. VP of R&D for Custom IC and Simulation, Cadence) <BR> “The Internet of Every-Thing: EDA Perspectives”, <BR> - <STRONG>J. Thomas Pawlowski</STRONG> (Fellow and Chief Technologist, Micron Technology, Inc.) <BR> “The Future of Memory/Logic Technologies and Computing System Architectures”, <BR> - <STRONG>Scott Runner</STRONG> (VP of Advanced Methodologies and Low-Power Design, Qualcomm)<BR> "SoCs for Mobile Applications:Systems from 0 MPH to over 100 MPH";</FONT></P>
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<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=2 face="Courier New, Courier, mono"> • SoCC Student Grant sponsored by IEEE CASS Outreach Initiative, including Student<BR> Travel Grant and Student Tutorial School Grant;</FONT></P>
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<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=2 face="Courier New, Courier, mono"> • A new “Design Track” to encourage engineers to present their work and share their<BR> knowledge and experience in the development of SoC designs; and</FONT></P>
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<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=2 face="Courier New, Courier, mono"> • A high quality social events program, including a Las Vegas show, conference banquet,<BR> and a tour of the cavernous power house of Hoover Dam hydro-electric plant.</FONT></P>
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<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT face="Courier New, Courier, mono"><FONT size=2>Contact us at </FONT><A href="mailto:info@ieee-socc.org"><FONT size=2>info@ieee-socc.org</FONT></A><FONT size=2>, follow us on </FONT><A href="mailto:twitter@ieee_socc"><FONT size=2>twitter@ieee_socc</FONT></A><FONT size=2>, and join us in LinkedIn </FONT></FONT></P>
<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=2 face="Courier New, Courier, mono">SOCC Group.</FONT></P>
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<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT face="Courier New, Courier, mono"><FONT size=2><STRONG>SUBMISSION OF PAPERS AND WORKSHOP/TUTORIAL/SPECIAL SESSION PROPOSALS</STRONG> </FONT></FONT></P>
<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT face="Courier New, Courier, mono"><FONT size=2>Online paper submissions are in pdf format, limited to six double-column IEEE format<BR>pages. Paper submissions will go through a double-blind peer review process. The SOCC<BR>proceedings will be submitted to IEEE Xplore®. Workshop/tutorial proposals with title, <BR>a one-page summary, and speaker’s short bio are submitted to the Tutorial Chair. Special<BR>session proposals may include title, topic rationale, organizer’s short bio, and a list <BR>of contributed papers, which are submitted to the TPC Chairs. “Design Track” submissions<BR>require a two-page extended abstract which will be published on the SOCC website and in<BR>the program. For detailed formatting instructions and submission guidelines, please refer to<BR></FONT><A href="http://www.ieee-socc.org"><FONT size=2>www.ieee-socc.org</FONT></A><FONT size=2>.</FONT></FONT></P>
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<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT face="Courier New, Courier, mono"><FONT size=2><STRONG>SOCC AREAS OF INTEREST</STRONG><BR>Papers are invited which address new and previously unpublished results in the areas:<BR> • Analog and Mixed-Signal Circuits and Systems<BR> • Biomedical Circuits and Systems<BR> • Wireline and Wireless Communication Circuits and Systems<BR> • Digital Signal Processing (DSP) Circuits and Systems<BR> • Low-Power, “Green” Circuits, Systems, and Design Methodologies<BR> • Embedded Systems, Multi/Many Core Systems & Embedded Memory Technologies<BR> • Network on Chip (NoC), Interconnects, and 3D-IC<BR> • Reconfigurable and Programmable Circuits and Systems<BR> • System Level Design Methodology and Tools<BR> • Design for Testability and Manufacturability<BR> • Design Verification<BR> • Computing Platform Architectures</FONT></FONT></P>
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<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT face="Courier New, Courier, mono"><FONT size=2><STRONG>KEY DATES</STRONG><BR> Special session proposal submission deadline: <FONT color=#ff0000>April 14th, 2014 (Extended)</FONT><BR> Regular paper submission deadline: <FONT color=#ff0000>May 2nd, 2014 (Final)</FONT></FONT></FONT></P>
<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT face="Courier New, Courier, mono"><FONT size=2> SoC Design Track extended abstract due: <FONT color=#ff0000>May 2nd, 2014 (Final)</FONT><BR> Notification of acceptance: June 10th, 2014<BR> Final camera?ready paper due: June 30th, 2014</FONT></FONT></P>
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<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT face="Courier New, Courier, mono"><FONT size=2><STRONG>ORGANIZING COMMITTEE<BR></STRONG> Conference General Chair: Kaijian Shi, Cadence Design Systems<BR> Technical Program Chair: Thomas Buechner, IBM<BR> Technical Program Co-Chair: Danella Zhao, Univ. of Louisiana at Lafayette<BR> Financial Chair: Ramalingam Sridhar, SUNY at Buffalo<BR> Tutorial Chair: Yuejian Wu, Infinera<BR> Publicity Chair Andrew Marshall, University of Texas at Dallas<BR> Sponsorship/Exhibition Chair Karan Bhatia, Texas Instruments<BR> Local OC Chair Venki Muthukumar, Univ. of Nevada Las Vegas<BR> Steering Committee Chair Norbert Schuhmann, Fraunhofer IIS<BR> Europe Liaison Sakir Sezer, Queen’s University, Belfast<BR> Asia-Pacific Liaison Sao-Jie Chen, National Taiwan University<BR> Industrial Liaison Nagi Naganathan, LSI Corp.</FONT></FONT></P>
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