[ecoop-info] IEEE PerCom 2010 cfp - Submission Deadline: Sept. 28, 2009
Paolo Bellavista
paolo.bellavista at unibo.it
Thu Sep 10 18:26:49 CEST 2009
Our sincere apologies if you receive multiple copies of this announcement.
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CALL FOR PAPERS
Eighth IEEE International Conference on Pervasive Computing and Communications
PerCom 2010 (http//www.percom.org/)
Mannheim, Germany, March 29 - April 2, 2010
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**** Paper Submission Deadline --- September 28, 2009 ****
Sponsored by
IEEE, IEEE Computer Society
The University of Texas at Arlington
IEEE TCPP, IEEE TCCC
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IEEE PerCom, now at its eighth edition, is the
premier scholarly venue in the areas of pervasive
computing and communications, which aim at
providing a ubiquitous platform for supporting
exciting anytime and anyplace services paradigms.
Pervasive computing and communications is a
natural outcome of the tremendous advances of a
broad spectrum of technologies including wireless
networking, sensor networks, mobile and
distributed computing, and agent technologies.
PerCom 2010 will provide a high profile, leading
edge forum for researchers and engineers alike to
present state-of-the-art research in the
respective fields of pervasive computing and
communications. The conference will feature a
diverse mixture of presentation forums including
core technical sessions, several targeted
workshops, demonstrations, keynote speeches and
panel discussions from domain experts.
TOPICS
Research contributions are solicited in all areas
pertinent to pervasive computing and communications, including:
- Innovative pervasive computing applications
- Programming paradigms for pervasive systems
- Software evolution and maintenance in pervasive systems
- Middleware services and agent technologies
- Adaptive, autonomic and context-aware computing
- Mobile/Wireless computing systems and services in pervasive computing
- Energy-efficient and green pervasive computing
- Communication architectures for pervasive computing
- Ad hoc networks for pervasive communications
- Pervasive opportunistic communications and applications
- Enabling technologies for pervasive systems (e.g., wireless BAN, PAN)
- Positioning and tracking technologies
- Sensors and RFID in pervasive systems
- Multimodal sensing and context for pervasive applications
- Pervasive sensing, perception and semantic interpretation
- Smart devices and intelligent environments
- Trust, security and privacy issues in pervasive systems
- User interfaces and interaction models
- Virtual immersive communications
- Wearable computers
- Standards and interfaces for pervasive computing environments
- Social and economic models for pervasive systems
WORKSHOPS AND AFFILIATED EVENTS
Many workshops will be held in conjunction with
the main conference. Workshop papers will be
included and indexed in the IEEE digital
libraries (Xplore), showing their affiliation
with IEEE PerCom. As in the past, PerCom 2010
will also feature a PhD Forum, Demonstrations and
a Work-in-Progress Session. Please visit the conference website for details.
SUBMISSION GUIDELINES
Submitted papers must be unpublished and not
considered elsewhere for publication. Also, they
must show a significant relevance to pervasive
computing and networking. Guidelines for
preparing and submitting the manuscript are
available on the conference website
(http//www.percom.org/). All papers will be
managed electronically through EDAS. Submitted
papers will undergo a rigorous review process
handled by the Technical Program Committee.
MARK WEISER AWARD
The best paper will receive the prestigious Mark
Weiser Best Paper Award. Papers of particular
merit will be considered for a special issue of
the Elsevier journal of Pervasive and Mobile Computing (PMC).
IMPORTANT DATES
Paper Registration: Sept. 25, 2009
Paper Submission: Sept. 28, 2009
Author notification: Dec. 21, 2009
Camera-ready due: Jan. 29, 2010
For further Information, please contact Giuseppe
Anastasi at <giuseppe.anastasi at iet.unipi.it> or
visit the conference website (http://www.percom.org)
ORGANIZING COMMITTEE
General Co-chairs:
Christian Becker, University of Mannheim, Germany
Marco Conti, National Research Council, Italy
Program Chair:
Giuseppe Anastasi, University of Pisa, Italy
Program Vice Chairs:
Yonghe Liu, University of Texas at Arlington, USA
Daniela Nicklas, University of Oldenburg, Germany
Steve Ward, MIT, USA
Steering Committee Chair:
Mohan Kumar, University of Texas at Arlington, USA
Workshops Co-chairs:
Jalal Al Muhtadi, King Saud University, Saudi Arabia
Andrea Passarella, National Research Council, Italy
Keynotes Chair:
Vinny Cahill, Trinity College Dublin, Ireland
Panels Chair:
Djamshid Tavangarian, University of Rostock, Germany
Work in Progress Chair:
Achilles Kameas, University of Patras, Greece
Joerg Ott, Helsinky University of Technology, Finland
Demo Co-chairs:
Qi Han, Colorado School of Mines, USA
Pedro Jose Marron, University of Bonn, Germany
Ph.D. Forum Chair:
Claudio Bettini, University of Milan, Italy
Industrial Relations Co-chairs:
Paul Castro, IBM, USA
Igor Curcio, Nokia, Finland
York Sure, SAP AG, Germany
Finance and Registration Chair:
Gergely Záruba, University of Texas at Arlington, USA
Publication Chair:
Emilio Ancillotti, National Research Council, Italy
Alessio Vecchio, University of Pisa, Italy
Publicity Co-chairs:
Franca Delmastro, National Research Council, Italy
Dinh Q. Phung, Curtin University of Technology, Australia
Damla Turgut, University of Central Florida, USA
Zhiwen Yu, Northwestern Polytechnical University, China
Local Arrangements Chair:
Gregor Schiele, University of Mannheim, Germany
Submission Chair:
Antonio Pinizzotto, National Research Council, Italy
Website Liaison:
Nayantara (Tara) Mallesh, University of Texas at Arlington, USA
TECHNICAL PROGRAM COMMITTEE:
Jalal Al Muhtadi, King Saud University, Saudi Arabia
Habib Ammari, Hofstra University, USA
Francisco Ballestreros, Rey Juan Carlos University, Spain
Stefano Basagni, Northeastern University, USA
Martin Bauer, NEC Europe, Germany
Paolo Bellavista, University of Bologna, Italy
Claudio Bettini, University of Milan, Italy
Chatschik Bisdikian, IBM TJ Watson Research, USA
Susanne Boll, University of Oldenburg, Germany
Luciano Bononi, University of Bologna, Italy
Roy Campbell, University of Illinois at Urbana-Champaign, USA
Jiannong Cao, Hong Kong Polytechnic University, HK
Guohong Cao, Pennsylvania State University, USA
Surendar Chandra, University of Notre Dame, USA
Yingying Chen, Stevens Institute of Technology, USA
Diane J. Cook, Washington State University, USA
Paolo Costa, Microsoft Research, UK
Franca Delmastro, National Research Council, Italy
Karoly Farkas University of West Hungary, Hungary
Christian Floerkemeier, MIT, USA
Silvia Giordano, SUSPI, Switzerland
Tao Gu, University of Southern Denmark, Denmark
Isabelle Guérin Lassous, Université Lyon I/LIP, France
Qi Han, Colorado School of Mines, USA
Robert Harle, University of Cambridge, UK
Wenbo He, University of New Mexico, USA
Urs Hengartner, University of Waterloo, Canada
Manfred Huber, University of Texas at Arlington, USA
Jadwiga Indulska, University of Queensland Brisbane, Australia
Vana Kalogeraki, University of California, Riverside, USA
Achilles Kameas, University of Patras, Greece
Birgitta König-Ries, Universität Jena, Germany
Polychronis Koutsakis, Technical University of Crete, Greece
Mohan Kumar, University of Texas at Arlington, USA
Bob Kummerfeld, University of Sydney, Australia
Brent Lagesse, University of Texas at Arlington, USA,
Seng W. Loke, La Trobe University, Australia
Ulrike Lucke University of Rostock, Germany
Paul Lukowicz, University of Passau, Germany
Xun Luo, Qualcomm Inc., USA
Marco Mamei, Università di Modena e Reggio Emilia, Italy
Cecilia Mascolo, University of Cambridge, UK
Martin Mauve, Heinrich Heine University Düsseldorf, Germany
Scott Midkiff, Virginia Tech, USA
Bernhard Mitschang, University of Stuttgart, Germany
Refik Molva, Eurecom, France
Paul Muller, University of Kaiserslautern, Germany
Matt Mutka, Michigan State University, USA
Klara Nahrstedt, University of Illinois Urbana-Champaign, USA
Lionel M. Ni, Hong Kong University of Science & Technology, HK
Joerg Ott, Helsinki University of Technology, Finland
Justin Mazzola Paluska, MIT, USA,
Symeon Papavassiliou, National Technical University of Athens, Greece
Andrea Passarella, National Research Council, Italy
Tom Pfeifer, Waterford Institute of Technology, Ireland
Gian Pietro Picco, University of Trento, Italy
Claudio Pinhanez, IBM T.J. Watson Research Center, USA
Dinh Phung, Curtin University of Technology, Australia
Mandayam Raghunath, Google, India
Tirumale Ramesh, Boeing, USA
Anand Ranganathan, IBM T.J. Watson Research Center, USA
Nishkam Ravi, Intel, Santa Clara, USA
Daniele Riboni, University of Milan, Italy
Kay Roemer, ETH Zurich, Switzerland
Alex Rogers, Southampton University, UK
George Roussos, Birkbeck College, University of London, UK
Nirmalya Roy, University of Texas at Austin, USA
Enrico Rukzio, Lancaster University, UK
Ichiro Satoh, National Institute of Informatics, Japan
Gregor Schiele, University of Mannheim, Germany
Albrecht Schmidt, University of Duisburg-Essen, Germany
Fabio A. Schreiber, Polytechnic of Milan, Italy
Behrooz Shirazi, Washington State University, USA
Morris Sloman, Imperial College London, UK,
Ioannis Stavrakakis, National and Kapodistrian Univ. of Athens, Greece
Thomas Strang, German Aerospace Center, Germany
Gerhard Tröster, ETH Zürich, Switzerland
Gene Tsudik, University of California at Irvine, USA
Alessio Vecchio, University of Pisa, Italy
Nalini Venkatasubramamian, University of California at Irvine, USA
Matthew Wright, University of Texas at Arlington, USA
Li Xiao, Michigan State University, USA
David Yates, Bentley University, USA
Franco Zambonelli, University of Modena and Reggio, Italy
Gergely Zaruba, University of Texas at Arlington, USA
Daqing Zhang, GET/INT-National Institute of Telecommunications, France
Yanchao Zhang, New Jersey Institute of Technology, USA
Paolo Bellavista, Ph. D.
Associate Professor in Computer Science Engineering
EB Member of IEEE Communications and IEEE T. Services Computing
DEIS - Università degli Studi di Bologna
Viale Risorgimento, 2 - 40136 Bologna (ITALY)
Tel# +39-051-2093866; Fax# +39-051-2093073
Email: paolo.bellavista at unibo.it
Web: http://lia.deis.unibo.it/Staff/PaoloBellavista/
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