[ecoop-info] THE DEADLINE OF EUROMICRO DSD 2011 SUBMISSION IS APPROACHING
Paris Kitsos
pkitsos at eap.gr
Mon Feb 21 18:27:55 CET 2011
Please accept our apologies if you receive multiple copies of this call.
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DSD'2011 CALL FOR PAPERS
14th EUROMICRO CONFERENCE ON DIGITAL SYSTEM DESIGN
Architectures, Methods and Tools
Oulu, Finland, August 31 -- September 2, 2011
http://dsmc2.eap.gr/dsd2011/
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[IMPORTANT DATES]
- Submission of papers: March 14, 2011
- Notification of acceptance: April 24, 2011
- Camera ready papers: May 29, 2011
[SCOPE]
The Euromicro Conference on Digital System Design (DSD) addresses all
aspects of (embedded, pervasive and high-performance) digital and mixed
hardware/software system engineering, down to microarchitectures,
digital circuits and VLSI techniques. It is a discussion forum for
researchers and engineers from academia and industry working on
state-of-the-art investigations, development and applications. It
focuses on advanced circuit and system design and design automation
concepts, paradigms, methods and tools, as well as on modern
implementation technologies from full custom in nanometer technology
nodes to FPGA and to multicore infrastructures. Compiler assisted ASIP,
CMP, SMP, SMT, DSP-VLIW, GPU and platform based system design research
results are welcome. Design and Verification Languages and Standards,
High Level Synthesis, Efficiency, Density, Signal Integrity,
Testability, Timing Analysis and Timing Closure, Asynchronous
Techniques, Reconfigurable Architectures, Power Consumption,
Computational Power Speed and Performance, Productive Design Technology
and Engineering Flows, Manufacturability, Cost, Reliability, Error
Resilience, Complexity, or Process Variability issues, Modeling, Design
Experiences are covered in DSD.
The IEEE Conference Publishing Services (CPS), publishes the DSD
Proceedings, which are available worldwide through the IEEE Xplore
Digital Library. An extended version of the best papers will be
published in a special issue of the ISI-indexed Microprocessors and
Microsystems: Embedded Hardware Design journal, printed by Elsevier.
[MAIN TOPICS]
T1: (SHES) - System, hardware and embedded software design and automatic
synthesis: high-level, behavioral, register-transfer, logic and physical
circuit synthesis; arithmetic, signal processing and vector processing
units; graphics processing units and hardware accelerators; memory
design; communication architecture and protocols; specific circuits and
processors; multi-objective optimization observing power, performance,
communication traffic, interconnect architecture, layout, technology,
reliability, robustness, security, testability and other issues;
management of parallel computational resources, memory allocation and
hierarchy; hardware/software co-design; mapping of applications to
architectures; algorithm architecture matching; transaction level
modeling and higher-level modeling; virtual system prototyping; design
space exploration; synthesis of asynchronous and dataflow driven
systems, nanoelectronics; CAD for placement, routing, retiming, logic
optimization, technology mapping, system-level partitioning, logic
generators, testing and verification; CAD for modeling, analysis and
optimization of timing and power..
T2: (SoC & NoC) - Systems-on-a-chip and networks-on-a-chip:
multiprocessor systems on-a-chip (MPSoC), generic system platforms and
platform-based design; CMP, SMP, SMT, DSP, VLIW and ASIP
(multi)processor architectures and enhancements; 3D MPSoCs; software
design and programming models for multicore platforms; benchmarks; GPUs;
cell-based platforms; NoC architectural issues, quality of service in
NoCs; 3D NoCs; power dissipation and energy issues in SoCs and NoCs; IP
design, standardization and reuse; parallelism and scalability
techniques; virtual components; system on a system; compiler assisted
MPSoC; hardware support for embedded kernels; embedded software
features; static, run-time and dynamic optimizations of embedded systems.
T3: (RC) - Programmable/re-configurable/adaptable architectures: design
methodologies and tools for reconfigurable computing, run-time, partial
and dynamic reconfigurability; fine-grained, mixed-grained and
coarse-grained reconfigurable architectures; reconfigurable
interconnections and NoCs; FPGAs; systems on re-configurable chip;
system FPGAs and structured ASICs and co-processors; processing arrays;
programmable fabrics; novel logic block architectures, combination of
FPGA fabric and system blocks (DSP, processors, memories, etc.);
adaptive computing devices, systems and software; adaptable ASIPs and
ASIP-based SOCs, hardware accelerators; optimization of FPGA-based
cores; shared resource management; novel design algorithms for FPGA
features; high-level models and tools for FPGAs; rapid prototyping
systems and platforms; wireless and mobile systems.
T4: (SMVT) - System, hardware and embedded-software specification,
modeling, verification and test: design, modeling, simulation and
verification languages; functional, structural and parametric
specification and modeling, model-based design and verification; system,
hardware, and embedded software analysis; simulation, emulation,
prototyping, formal verification, design-for-test and testing at all
design levels; dependability and fault-tolerance issues.
T5: (APP) - Applications of (embedded) digital systems: emphasis on
design challenges posed by demanding and new applications in fields such
as: (wireless) communication and networking; networked electronic media,
multimedia and ambient intelligence; image and video processing; mobile
systems; health-care and medicine; ubiquitous, wearable and implanted
systems; military, space, avionics, measurement, control and automotive
applications; wireless sensor network applications; surveillance and
security; environmental, agriculture, urban, building, transportation,
traffic, energy, hazards and disasters monitoring and control.
T6: (ET) - Important issues introduced by emerging technologies: issues
for the system, circuit and embedded software design introduced by e.g.
the nanometer CMOS and beyond CMOS technologies, 3D integration, optical
and new memory technologies etc.; new human-machine interfaces, neural-
and bio-computation, (bio)sensor and sensor network technologies,
pervasive and ubiquitous computing, 'internet of things'; design methods
and EDA tools for solving these issues.
[SPECIAL SESSIONS]
? SS1: (FDR) - Flexible Digital Radio.
? SS2: (MSDA) - Multicore Systems: Design and Applications.
? SS3: (DTDS) - Dependability and Testing of Digital Systems.
? SS4: (FTDSD) - Fault Tolerance in Digital System Design.
? SS5: (SLEO) - System-Level Energy Optimization of HW/SW Embedded
Systems.
? SS6: (WSN) - Wireless Sensor Networks.
? SS7: (AHSA) - Architectures and Hardware for Security Applications.
? SS8: (M2APS) - Monitoring Methods for Adaptive Parallel Systems.
More information on special sessions:
http://dsmc2.eap.gr/dsd2011/index.php?page=8
[SUBMISSION GUIDELINES]
Regular Papers: Prospective authors are encouraged to submit their
manuscripts for review electronically through the following web page
(https://www.conftool.net/dsd2011/) or by sending the paper to the
Program Chair via email (pkitsos at eap.gr, only if an unexpected web
access problem is encountered) before the deadline for submission. Each
manuscript should include the complete paper text, all illustrations,
and references. The manuscript should conform to the required IEEE
format: single-spaced, double column, A4/US letter page size, 10-point
size Times Roman font, up to 8 pages. In order to conduct a blind
review, no indication of the authors' names should appear in the
submitted manuscript, references included.
Case Studies and Application Papers: Submissions can be made which
report on state-of-the-art digital systems, digital designs,
architectures, design methods and/or tools, and (embedded) applications.
Papers discussing lessons learned from practical experience, demanding
or new applications, and experimental research are particularly
encouraged. Manuscripts may be submitted in the same way as regular papers.
[CONFERENCE COMMITTEES]
DSD STEERING COMMITTEE:
Chairman: Lech Jozwiak, Eindhoven U. of Tech. (NL)
Krzysztof Kuchcinski, Lund U. (SE)
Antonio Nunez, IUMA/U. Las Palmas GC (ES)
DSD11 GENERAL CHAIR:
Pekka Abrahamsson, University of Helsinki, (FI)
DSD11 PROGRAM COMMITTEE CHAIR:
Program Chairman: Paris Kitsos, Hellenic Open Univ., (GR)
Deputy Program Chairman: Smail Niar, U. Lille North France, Valencienne,
(FR)
DSD11 LOCAL ORGANIZING CHAIR:
Chair: Pasi Kuvaja, University of Oulu, (FI)
DSD11 PROGRAM COMMITTEE:
A. Akkas, St. Cloud State U., (US)
A. Lastovetsky, University College Dublin, (IR)
A. Nunez, IUMA/U. of Las Palmas G.C., (ES)
A. Orailoglu, U. of California, San Diego, (US)
A. Pawlak, ITE & SUT, (PL)
A. Postula, U. of Queensland, (AU)
A. Shrivastava, Arizona State U., (US)
B. Juurlink, TU Berlin (DE)
C. Bouganis, Imperial College, (UK)
C. Cornelius, U. of Rostock, (DE)
C. Wolinski, IRISA, Rennes, (FR)
D. Houzet, Grenoble Institute of Technology, (FR)
D. Noguet, Minatec CEA-LETI, (FR)
D. Quaglia, U. of Verona, (IT)
E. Martins, U. of Aveiro, (PT)
F. Leporati, U. of Pavia, (IT)
G. Danese, U. Of Pavia, (IT)
H. Basson, U. of Littoral, (FR)
H. Kubatova, CTU Prague, (CZ)
H.T. Vierhaus, Brandenburg U. of Tech., (DE)
I. Hamzaoglu, Sabanci U., (TK)
J. Haid, Infineon Technologies, (AT)
J. Rabaey, U. of California, Berkeley, (US)
J. Sahuquillo, Pol. U. of Valencia, (ES)
J. Tiberghien, U. Libre de Bruxelles, (BE)
J.L. Dekeyser, U. of Lille, (FR)
J.S. Matos, U. of Porto, (PT)
K. Kent, U. of New Brunswick, (CA)
K. Kuchcinski, Lund U., (SE)
K. Popovici, Mathworks Inc., (US)
L. Benini, U. of Bologna, (IT)
L. Fanucci, U. of Pisa, (IT)
L. Jozwiak, Eindh. U. of Tech., (NL)
L. Sousa, U. of Lisboa, (PT)
L.-G. Chen, National Taiwan U., (TW)
M. Berekovic, TU Braunschweig (DE)
M. Figueroa, U. of Concepcion, (CL)
M. K. Michail, U. of Cyprus, (CY)
M. Perkowski, Portland St. U., (US)
M. Valero, Pol. U. of Catalunya, (ES)
M. Velev, Aries Design Automation, (US)
N. Dutt, U. of Calif., Irvine, (US)
N. Nedjah, State U. of Rio de Janeiro, (BR)
N. Sklavos, Tech. Inst. Patras, (GR)
O. Koufopavlou, U. Patras, (GR)
P. Carballo, IUMA/U. of Las Palmas GC, (ES)
P. Kitsos, Hellenic Open U., (GR)
P. Schumacher, Xilinx Inc., (US)
R. Drechsler, U. of Bremen, (DE)
R. Cumplido, INAOE, (MX)
R. Ubar, Tallinn Tech. U., (EE)
S. Kumar, Jonkoping U., (SE)
S. Lopez, IUMA/U. of Las Palmas G.C., (ES)
S. Niar, U. Valenciennes, (FR)
S. Vitabile, U. of Palermo, (IT)
T. El-Ghazawi, George Washington U., (US)
T. Luba, Warsaw U. of Tech., (PL)
T. Sasao, Kyushu Ins. of Tech., (JP)
V. Muthukumar, U. of Nevada Las Vegas, (US)
V. Prasanna, U. of Southern California, (US)
W. Luk, Imperial College, (UK)
W. Stechele, Technical U. Munich, (DE)
Z. Kotasek, Brno U. of Tech., (CZ)
DSD permanent homepage is at:
http://www.ics.ele.tue.nl/~dsd/
US mirror:
http://www.dsdconf.org/
Euromicro homepage is at:
http://www.euromicro.org/
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