[ecoop-info] DAIS'2010: Call for papers

Hans P. Reiser reiser at cs.fau.de
Fri Nov 20 12:57:47 CET 2009


                             CALL FOR PAPERS 
                              10th IFIP WG 6.1
                       International Conference on
          Distributed Applications and Interoperable Systems

                              DAIS 2010 

              "Applications and services for a complex world"

                       Amsterdam, The Netherlands
                          June 7-9, 2010

                   To be held in conjunction with 
               FMOODS/FORTE 2010  and  Coordination 2010



Distributed application technology has become a foundation of the information
society. New computing and communication technologies have brought up a
multitude of challenging application areas, including mobile computing,
inter-enterprise collaborations, ubiquitous services, service-oriented
architectures, autonomous and self-adapting systems, peer-to-peer systems,
just to name a few. New challenges include the need for novel abstractions
supporting the development, deployment, management and interoperability of
evolutionary and complex applications and services, such as those bridging the
physical/virtual worlds. Therefore, the linkage between applications,
platforms and users through multi-disciplinary user requirements (like
security, privacy, usability, efficiency, safety, semantic and pragmatic
interoperability of data and services, dependability, trust and
self-adaptivity) becomes of special interest. It is envisaged that future
complex applications will far exceed those of today in terms of these

The DAIS conference series addresses all aspects of distributed applications,
including their design, implementation and operation, the supporting
middleware, appropriate software engineering methodologies and tools, as well
as experimental studies and practice reports. This time we welcome in
particular contributions on architectures, models, technologies and platforms
for large scale and complex distributed applications and services that are
related to the latest trends towards bridging the physical/virtual worlds
based on flexible and versatile service architectures and platforms.

DAIS'10 is the 10th event in a series of successful international conferences
which started in 1997. It will provide a forum for researchers, application
and platform service vendors and users, to review, discuss and learn about new
approaches, trends, concepts and experiences in the fields of distributed


DAIS'10 solicits high quality papers reporting research results and/or
experience reports. All papers must be original, unpublished, and not
submitted simultaneously for publication elsewhere.

DAIS'10 especially encourages submissions addressing the following topics:

- novel and innovative applications in the areas of
  * ubiquitous and pervasive computing    
  * sensor networks             
  * mobile computing   
  * peer-to-peer systems and platforms       
  * Cloud and enterprise computing 
  * collaborative intelligent devices (e.g., robots) 
- models, methodology and concepts supporting distributed applications with
  respect to
  * sustainability 
  * dependability and resilience 
  * evolution 
  * energy efficiency
  * robustness and trust 
  * usability
  * autonomy

- middleware and software engineering techniques supporting distributed
  applications in the areas of
  * autonomic and resilient systems 
  * mobile systems 
  * context- and QoS-aware systems 
  * evolution of service-oriented applications 
  * enterprise-wide and global integration 
  * semantic interoperability 
  * application and service management 
  * domain-specific modelling languages 
  * model-driven software development, testing, validation, and adaptation 
  * model evolution 
  * software architecture and patterns  


Submissions must be done electronically as postscript or PDF, using the
Springer LNCS style. DAIS'10 seeks:

- Full technical papers in no more than 14 pages, 
- Work-in-progress papers, describing on-going work and interim results, 
  in no more than 6 pages. 

Both categories of papers will be reviewed thoroughly by the DAIS'10 Program
Committee. Accepted papers will appear in the conference proceedings published
by Springer Verlag in the LNCS series. More specific guidelines on the
preparation of papers can be found on the conference website. 

*New:* Extended versions of selected best papers published in DAIS'10 will be
invited for publication in a dedicated special issue of Wiley Software:
Practice and Experience


Abstract submission                           February  8,  2010 
Full paper submission:                        February 12,  2010
Notification of acceptance:                   March    19,  2010
Camera ready version:                         April     2,  2010
Conference dates:                             June    7-9,  2010                    


DAIS'10 will be held in the multi-faced city of Amsterdam, The Netherlands, as
a part of the federated conferences DisCoTec (Distributed Computing
Techniques), together with the 12th International Conference on Coordination
Models and Languages (COORDINATION) and the IFIP International Conference
Formal Methods for Distributed Systems (FMOODS/FORTE).


General chair: 
Frank S. de Boer, Centrum Wiskunde & Informatica (CWI), Netherlands

Steering committee:
Kurt Geihs, University of Kassel, Germany
Jadwiga Indulska, University of Queensland, Australia
Lea Kutvonen (chair), University of Helsinki, Finland
Elie Najm, ENST, France
Rui Oliveira, Universidade do Minho, Portugal
Rene Meier, Trinity College Dublin, Ireland
Twittie Senivongse, Chulalongkorn University, Thailand
Sotirios Terzis, University of Strathclyde, UK

PC Chairs:
Frank Eliassen, University of Oslo, Norway
Ruediger Kapitza, FAU Erlangen-Nuremberg, Germany

Publicity chair:      
Johan Fabry, Universidad de Chile, Chile
Hans P. Reiser, University of Lisboa, Portugal
Charles Zhang, Hong Kong University of Science and Technology, China

Program committee:
M. Aoyama, Nanzan University, Japan
J. E. Armendariz-Inigo, Universidad Publica de Navarra, Spain
D. Bakken, Washington State University, USA
Y. Berbers, Katholieke Universiteit Leuven, Belgium
A. Beresford, University of Cambridge, UK
A. Beugnard, TELECOM Bretagne, France
G. Blair, Lancaster University, UK
A. Casimiro, University of Lisbon, Portugal
E. Cecchet, University of Massachusetts, USA 
I. Demeure, ENST, France
S. Dobson, University of St Andrews, Scotland
J. Dowling, SICS, Sweden
D. Donsez, Universite Joseph Fourier , France
N. Dulay, Imperial College London, UK
F. Eliassen, University of Oslo, Norway  
S. Elnikety, Microsoft Research, USA
P. Felber, Universite de Neuchatel, Switzerland
K. Geihs, University of Kassel, Germany
N. Georgantas, INRIA, France
K. Goeschka, Vienna University of Technology, Austria
R. Gronmo, SINTEF, Norway
D. Hagimont, INP Toulouse, France
S. Hallsteinsen, SINTEF, Norway
P. Herrmann, NTNU Trondheim, Norway
J. Indulska, University of Queensland, Australia
R. Kapitza, University of Erlangen-Nuernberg, Germany
H. Koenig, BTU Cottbus, Germany
R. Kroeger, University of Applied Sciences, Wiesbaden, Germany
L. Kutvonen, University of Helsinki, Finland
W. Lamersdorf, University of Hamburg, Germany
M. Lawley, Queensland University of Technology, Australia
P. Linington, University of Kent, UK
C. Linnhoff-Popien, Munich University, Germany
K. Lund, Norwegian Defence Research Establishment (FFI), Norway
R. Macedo, Federal University of Bahia, Brazil
R. Meier, Trinity College Dublin, Ireland
A. Montresor, University of Trento, Italy
E. Najm, ENST, France
N. Narasimhan, Motorola Labs, USA
R. Oliveira, Universidade do Minho, Portugal
G. Pierre, Vrije Universiteit Amsterdam, The Netherlands
P. Pietzuch, Imperial College London, UK
A. Puder, State University San Francisco, USA
R. Rouvoy, University of Lille 1, France
D. Schmidt, Vanderbilt University, USA
T. Senivongse, Chulalongkorn University, Thailand
K. Sere, Abo Akademi University, Finland
S. Terzis, University of Strathclyde, UK
H. Yokota, Tokyo Institute of Technology, Japan 

More information about the ecoop-info mailing list